SilentiumPC Pactum PT-4 improves thermal conductivity of cooling systems
Improved thermal conductivity
Pactum PT-4 compound is SilentiumPC’s next step towards improving the cooling efficiency of integrated circuits. Advanced formulation with very high thermal conductivity significantly improves heat flow between the chip and its cooling system, reducing operating temperature. That also increases the frequency headroom, whether by automatic boost modes of modern computing engines or manual overclocking.
Perfect compound for every cooling system
Easy application and spread are achieved thanks to the Pactum PT-4’s relatively low viscosity. Large surfaces of modern heat spreaders (IHS) can be easily covered using the included spatula. The compound is non-conductive and can be safely used with all common metals, including copper, nickel and aluminium. It is also non-curing and does not require long thermal cycling to achieve its advertised performance.
Pactum PT-4 is available in syringes containing 1,5 or 4 g of the compound. Depending on the size of the chip, the amount is sufficient for two to five applications for the small syringe or six to 13 applications the the big syringe.
The new Pactum PT-4 is available from today.
|SilentiumPC Pactum PT-4 4 g||SPC310||2 years||6,99€|
|SilentiumPC Pactum PT-4 1.5 g||SPC309||2 years||3,99€|
*MSRP, incl. VAT/Taxes.